BOE Technology Group Co., Ltd. patent applications on April 10th, 2025
Patent Applications by BOE Technology Group Co., Ltd. on April 10th, 2025
BOE Technology Group Co., Ltd.: 19 patent applications
BOE Technology Group Co., Ltd. has applied for patents in the areas of H10K59/131 (5), H10H29/85 (2), H10K59/12 (2), G09G3/3233 (2), H10K59/121 (2) H10K59/131 (2), H10H29/857 (2), A61K35/28 (1), H01Q9/0414 (1), H10K50/19 (1)
With keywords such as: layer, device, display, light, recording, structure, substrate, position, target, and emitting in patent application abstracts.
Patent Applications by BOE Technology Group Co., Ltd.
Inventor(s): Wenbin WANG of Beijing CN for boe technology group co., ltd.
IPC Code(s): B29C65/74, B29C65/58, B29L31/34
CPC Code(s): B29C65/749
Abstract: the present disclosure provides a buckle assembly, a pressing and cutting jig, and a method and an apparatus for manufacturing a package structure. the buckle assembly includes a plurality of buckle structures, one plastic frame structure, and one support; an outer contour of the plastic frame structure is matched with an outer contour of a housing of an electronic product; the plastic frame structure is provided with a plurality of openings, and each buckle structure is embedded into one of the openings; the support is disposed in an annular area defined by the plastic frame structure; the support is divided into a plurality of branches each having a first end and a second end, first ends of different branches are connected, while the second end of each branch is connected to one of the buckle structures.
Inventor(s): Xinkai LI of Beijing CN for boe technology group co., ltd., Lili CHEN of Beijing CN for boe technology group co., ltd., Yaoyu LV of Beijing CN for boe technology group co., ltd., Siyan MA of Beijing CN for boe technology group co., ltd., Yan LI of Beijing CN for boe technology group co., ltd.
IPC Code(s): G02B30/31, G06F3/01, G06T7/60, G06T7/73, G06T17/00, G09G3/00, G09G3/34
CPC Code(s): G02B30/31
Abstract: provided in the present disclosure are a driving method for a liquid crystal grating, and a display apparatus and a display method for a display apparatus. the driving method for a liquid crystal grating comprises: determining the real-time position of the center of a pupil; according to the real-time position, and a pre-established correspondence between the position of the center of the pupil and the position of a light-transmitting region in a liquid crystal grating, determining the position of the light-transmitting region in the liquid crystal grating that corresponds to the real-time position; and driving the liquid crystal grating, such that the liquid crystal grating only transmits light at the position of the light-transmitting region that corresponds to the real-time position.
Inventor(s): Xintong Zhu of Beijing CN for boe technology group co., ltd., Zhihong Du of Beijing CN for boe technology group co., ltd., Wenbo LI of Beijing CN for boe technology group co., ltd., Jindou Liu of Beijing CN for boe technology group co., ltd., Hanbing Zhang of Beijing CN for boe technology group co., ltd.
IPC Code(s): G02B30/56, G02B1/02, G02B5/09, G02B27/01
CPC Code(s): G02B30/56
Abstract: an optical device is disclosed. the optical device includes a plurality of reflective pillars extending in a first direction, and the plurality of reflective pillars are arranged in a plurality of rows and a plurality of columns. the first direction is perpendicular to both a row direction and a column direction. every at least three adjacent reflective pillars define an optical channel extending in the first direction. each optical channel includes a plurality of reflective surfaces arranged in a circumferential direction of the optical channel, and the plurality of reflective surfaces include two reflective surfaces that are adjacent and perpendicular to each other. a plurality of reflective surfaces defining the optical channel are respectively located on different reflective pillars.
Inventor(s): Zhihui CHEN of Beijing CN for boe technology group co., ltd.
IPC Code(s): G08B6/00
CPC Code(s): G08B6/00
Abstract: a haptic feedback signal detection circuit (-), a driving control circuit (), and a haptic feedback apparatus. the haptic feedback signal detection circuit (-) comprises: a charge-voltage conversion circuit (-) coupled to at least one haptic detection piezoelectric device (-) in a haptic feedback panel (), wherein the charge-voltage conversion circuit (-) is configured to convert, when a target object is pressed, a charge signal of each of the at least one haptic detection piezoelectric device (-) into an initial voltage signal and then output the initial voltage signal; and at least one voltage amplifier circuit (-), wherein the at least one voltage amplifier circuit (-) is configured to sequentially amplify the initial voltage signals into target voltage signals and then output the target voltage signals to a detection output end as haptic feedback signals.
Inventor(s): Panwei FAN of Beijing CN for boe technology group co., ltd., Ruixiang CHEN of Beijing CN for boe technology group co., ltd.
IPC Code(s): H04N21/231
CPC Code(s): H04N21/231
Abstract: the present disclosure relates to a device control method, system and apparatus, a server, and a medium. according to the present disclosure, in response to a recording plan creation instruction, a recording plan that includes at least a device identifier of a video device for video recording is generated, and the generated recording plan is stored. since the device identifier of the video device is globally unique, in a case where recording conditions of a stored target recording plan are met, a second server is controlled to interact with a target video device indicated by a device identifier in the target recording plan and perform video recording through a target port in the target video device, thereby making it more convenient and flexible to control the video device to perform recording.
Inventor(s): Wei LI of Beijing CN for boe technology group co., ltd., Mingxing WANG of Beijing CN for boe technology group co., ltd., Zhiqiang JIAO of Beijing CN for boe technology group co., ltd., Qian SUN of Beijing CN for boe technology group co., ltd., Huajie YAN of Beijing CN for boe technology group co., ltd., Yichi ZHANG of Beijing CN for boe technology group co., ltd.
IPC Code(s): H10H29/85, H10H20/01, H10H20/812, H10H20/825, H10H29/01, H10H29/852, H10H29/855
CPC Code(s): H10H29/857
Abstract: a chip structure includes a chip wafer unit and a color conversion substrate unit disposed on a light-exit side of the chip wafer unit. the chip wafer unit includes a light-emitting layer and an electrode layer sequentially stacked in a first direction. the light-emitting layer includes light-emitting portions. each light-emitting portion includes at least two light-emitting sub-portions. the electrode layer includes a cathode, connection electrodes, and anodes in one-to-one correspondence with the light-emitting portions. the at least two light-emitting sub-portions are sequentially connected through at least one connection electrode. among the at least two light-emitting sub-portions sequentially connected, a first one light-emitting sub-portion is a first selected light-emitting sub-portion, and a last one light-emitting sub-portion is a second selected light-emitting sub-portion. the first selected light-emitting sub-portion is connected to the cathode, and the second selected light-emitting sub-portion is connected to an anode.
Inventor(s): Haixu Li of Beijing CN for boe technology group co., ltd.
IPC Code(s): H10H29/85, H10H29/03, H10H29/80, H10H29/855
CPC Code(s): H10H29/857
Abstract: a display substrate, including a first substrate and a backplane arranged in a sequentially laminated manner, and a light-emitting layer, where the light-emitting layer includes a binding pads and a light-emitting elements arranged one-to-one corresponding to each other, where the binding pad is arranged on a side of the backplane away from the first substrate, and a pin of the light-emitting element is electrically connected to the binding pad, where the binding pad includes a first region and a second region, the orthographic projection of the first region on the backplane is covered by the orthographic projection of the light-emitting element on the backplane, and the orthographic projection of the second region on the backplane is arranged on the outer side of the orthographic projection of the light-emitting element on the backplane.
Inventor(s): Changyen WU of Beijing CN for boe technology group co., ltd., Juanjuan YOU of Beijing CN for boe technology group co., ltd., Wei QUAN of Beijing CN for boe technology group co., ltd., Cheng XU of Beijing CN for boe technology group co., ltd., Dandan ZHOU of Beijing CN for boe technology group co., ltd.
IPC Code(s): H10K50/19, H10K59/131, H10K59/32, H10K101/40
CPC Code(s): H10K50/19
Abstract: a light emitting diode, a display substrate and a display device. in the light emitting diode, the first light emitting structure includes a first hole transport layer, a first light emitting layer and a first electron transport layer; the second light emitting structure includes a second hole transport layer and a second light emitting layer, an absolute value of a first energy level difference between a lumo energy level of the first light emitting layer and a lumo energy level of the first electron transport layer is less than an absolute value of a second energy level difference between a homo energy level of the second light emitting layer and a homo energy level of the second hole transport layer.
Inventor(s): Wei YANG of Beijing CN for boe technology group co., ltd., Guangcai Yuan of Beijing CN for boe technology group co., ltd., Ce Ning of Beijjing CN for boe technology group co., ltd., Xinhong Lu of Beijing CN for boe technology group co., ltd., Tianmin Zhou of Beijing CN for boe technology group co., ltd., Xin Yang of Beijing CN for boe technology group co., ltd.
IPC Code(s): H10K59/121, H10D86/40, H10D86/60, H10K59/12, H10K59/123, H10K59/131
CPC Code(s): H10K77/111
Abstract: the present disclosure relates to an oled display panel and display device. the oled display panel includes: a display area, a bending area and a bonding area, the display panel further includes: a base substrate; a first semiconductor pattern on the base substrate; a first insulating layer group on the first semiconductor pattern; a second semiconductor pattern on the first insulating layer group; a second insulating layer group on the second semiconductor pattern; first via holes in the first insulating layer group and the second insulating layer group; second via holes in the second insulating layer group, the display panel further includes: a metal trace, located on a side of the second insulating layer group away from the base substrate, and configured to connect a trace in the display area to a circuit board of the bending area; and a second source electrode and/or a second drain electrode.
BOE Technology Group Co., Ltd. patent applications on April 10th, 2025
- BOE Technology Group Co., Ltd.
- B29C65/74
- B29C65/58
- B29L31/34
- CPC B29C65/749
- Boe technology group co., ltd.
- G02B30/31
- G06F3/01
- G06T7/60
- G06T7/73
- G06T17/00
- G09G3/00
- G09G3/34
- CPC G02B30/31
- G02B30/56
- G02B1/02
- G02B5/09
- G02B27/01
- CPC G02B30/56
- G08B6/00
- CPC G08B6/00
- H04N21/231
- CPC H04N21/231
- H10H29/85
- H10H20/01
- H10H20/812
- H10H20/825
- H10H29/01
- H10H29/852
- H10H29/855
- CPC H10H29/857
- H10H29/03
- H10H29/80
- H10K50/19
- H10K59/131
- H10K59/32
- H10K101/40
- CPC H10K50/19
- H10K59/121
- H10D86/40
- H10D86/60
- H10K59/12
- H10K59/123
- CPC H10K77/111
- G09G3/3233
