Applied materials, inc. (20250129477). SYSTEM FOR ADJUSTING PROCESS CHAMBER COMPONENT TEMPERATURE
SYSTEM FOR ADJUSTING PROCESS CHAMBER COMPONENT TEMPERATURE
Organization Name
Inventor(s)
Zhepeng Cong of San Jose CA US
Vinh N. Tran of San Jose CA US
Vishwas Kumar Pandey of Madhya Pradesh IN
Ala Moradian of Sunnyvale CA US
Abraham Palaty of San Jose CA US
SYSTEM FOR ADJUSTING PROCESS CHAMBER COMPONENT TEMPERATURE
This abstract first appeared for US patent application 20250129477 titled 'SYSTEM FOR ADJUSTING PROCESS CHAMBER COMPONENT TEMPERATURE
Original Abstract Submitted
in one or more embodiments, a semiconductor processing kit includes a reflector assembly. the reflector assembly configured to support one or more sensing devices therein. the reflector assembly includes a body having a top surface and a volume at least partially defined by an inner surface and an outer surface. the reflector assembly further includes a baffle and a fluid channel disposed within the baffle. the fluid channel is configured to flow a fluid to adjust a temperature of the one or more sensing devices. a ring is disposed on the top surface. the ring is configured to reduce a flow of a fluid into the volume. a reflector is concentrically disposed radially outward of the outer surface and creates a gap that allows the fluid to partially flow between the inner surface of the reflector and the outer surface.