Applied materials, inc. (20250119076). SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE

SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE

Organization Name

applied materials, inc.

Inventor(s)

Arvinder Manmohan Singh Chadha of San Jose CA US

SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE

This abstract first appeared for US patent application 20250119076 titled 'SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE

Original Abstract Submitted

a substrate support assembly includes a first puck plate including one or more first functional elements, and a dielectric cooling plate is bonded to the first puck plate. the dielectric cooling plate includes one or more first channels for a coolant to flow therethrough, and one or more second channels for a gas to flow therethrough.