Applied materials, inc. (20250118586). ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

Organization Name

applied materials, inc.

Inventor(s)

Arvinder Manmohan Singh Chadha of San Jose CA US

ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

This abstract first appeared for US patent application 20250118586 titled 'ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

Original Abstract Submitted

a substrate support assembly includes a cooling plate and a chuck disposed on the cooling plate. the chuck includes one or more heating electrodes, and one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. another substrate support assembly includes a cooling plate, a first puck plate bonded to the cooling plate, and a second puck plate disposed on the first puck plate. the second puck plate includes one or more clamp electrodes to electrostatically secure the second puck plate to the first puck plate.