Applied materials, inc. (20250112029). SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID
SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID
Organization Name
Inventor(s)
Alvaro Garcia De Gorordo of Austin TX US
Michael T. Nichols of Eden Prairie MN US
SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID
This abstract first appeared for US patent application 20250112029 titled 'SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID
Original Abstract Submitted
semiconductor processing systems and system components are described for mitigating lid heating of a plasma processing chamber. one system includes a plasma-based processing chamber enclosing a processing region, the processing chamber comprising a first portion including sidewalls and a bottom and a second portion including a chamber lid; a substate support within the processing chamber and configured to retain a first substrate in the processing region of the chamber; an inductively coupled plasma source configured to direct rf energy into the chamber; a conductive structure proximate to the chamber lid on an exterior side of the processing chamber; and a power source configured to apply a negative charge to the conductive structure that generates an electric field through the chamber lid, the electric filed providing repulsion force to incident electrons.