Applied materials, inc. (20250095970). PLASMA PROCESSING CHAMBER LID COOLING
PLASMA PROCESSING CHAMBER LID COOLING
Organization Name
Inventor(s)
Rajinder Dhindsa of Pleasanton CA US
Michael Willwerth of Sunnyvale CA US
John Poulose of San Jose CA US
Kartik Ramaswamy of San Jose CA US
Valentin N. Todorow of Palo Alto CA US
Mario Schaefer of Altenstadt DE
PLASMA PROCESSING CHAMBER LID COOLING
This abstract first appeared for US patent application 20250095970 titled 'PLASMA PROCESSING CHAMBER LID COOLING
Original Abstract Submitted
semiconductor processing systems and system components are described for mitigating lid heating of a plasma processing chamber. one system includes a plasma-based processing chamber enclosing a processing region, the processing chamber comprising a first portion including sidewalls and a bottom and a second portion including a chamber lid; a substate support within the processing chamber and configured to retain a first substrate in the processing region of the chamber; and a conductive structure proximate to the chamber lid on an exterior side of the processing chamber, the conductive structure forming a particular pattern, the pattern comprising a heat transfer fluid pathway configured to circulate a heat transfer fluid through the conductive structure.
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