Applied materials, inc. (20250087494). SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL
SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL
Organization Name
Inventor(s)
Baiwei Wang of Santa Clara CA (US)
Rohan Puligoru Reddy of San Jose CA (US)
Xiaolin C. Chen of San Ramon CA (US)
Wanxing Xu of Sunnyvale CA (US)
Zhenjiang Cui of San Jose CA (US)
Anchuan Wang of San Jose CA (US)
SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL
This abstract first appeared for US patent application 20250087494 titled 'SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL
Original Abstract Submitted
exemplary semiconductor processing methods may include flowing an etchant precursor into a processing region of a semiconductor processing chamber. a substrate may be housed within the processing region. the substrate may define an exposed region of a metal-containing hardmask material and an exposed region of a material characterized by a dielectric constant of less than or about 4.0. the methods may include contacting the substrate with the etchant precursor. the methods may include removing at least a portion of the metal-containing hardmask material.
