Applied materials, inc. (20250008823). BARRIER ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODES
BARRIER ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODES
Organization Name
Inventor(s)
Zongkai Wu of Santa Clara CA US
Jungmin Lee of Santa Clara CA US
Chung-chia Chen of Hsinchu City TW
Kevin Chen of Santa Clara CA US
Wenhui Li of Santa Clara CA US
Soo Young Choi of Fremont CA US
BARRIER ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODES
This abstract first appeared for US patent application 20250008823 titled 'BARRIER ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODES
Original Abstract Submitted
sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display, such as an organic light-emitting diode (oled) display, are provided. in one example, a sub-pixel includes a substrate, adjacent overhang structures, an anode, an oled material, a cathode, an encapsulation layer stack. the encapsulation layer stack includes a first layer, a second layer disposed over the first layer, and a third layer. the first layer and the second layer have a first portion disposed over the cathode, a second portion disposed over a sidewall of each overhang structure, and a third portion disposed under an underside surface of an extension of each overhang structure. a gap is defined by contact of the first portion of the second layer and the third portion of the second layer. the third layer is disposed over the second layer outside of the gap.
- Applied materials, inc.
- Zongkai Wu of Santa Clara CA US
- Pei Chia Chen of Tokyo JP
- Wen-Hao Wu of San Jose CA US
- Jungmin Lee of Santa Clara CA US
- Chung-chia Chen of Hsinchu City TW
- Yu-Hsin Lin of Zhubei City TW
- Kevin Chen of Santa Clara CA US
- Wenhui Li of Santa Clara CA US
- Yu-Min Wang of Tainan City TW
- Lai Zhao of Campbell CA US
- Soo Young Choi of Fremont CA US
- H10K59/80
- H10K59/12
- H10K59/122
- CPC H10K59/8731