Applied materials, inc. (20250006523). APPARATUS AND METHODS FOR ADJUSTING PLATE TEMPERATURE
APPARATUS AND METHODS FOR ADJUSTING PLATE TEMPERATURE
Organization Name
Inventor(s)
Zhepeng Cong of San Jose CA US
Alain Duboust of Sunnyvale CA US
APPARATUS AND METHODS FOR ADJUSTING PLATE TEMPERATURE
This abstract first appeared for US patent application 20250006523 titled 'APPARATUS AND METHODS FOR ADJUSTING PLATE TEMPERATURE
Original Abstract Submitted
a non-transitory computer readable medium to thermally adjust a chamber component is disclosed therein. the non-transitory computer readable medium includes instructions that when executed cause a plurality of operations to be conducted. the operations include sensing a first temperature of the chamber component within a semiconductor processing chamber, comparing the first temperature to a first set-point of the chamber component, and adjusting a purge gas flowrate of a purge gas supplied to a portion of the processing chamber. the plurality of operations include sensing a second temperature of a reflector component in the portion of the semiconductor processing chamber, comparing the second temperature of the reflector component to a second set-point of the reflector component, and initiating a reflector cooling operation within the reflector component when the second temperature exceeds the second set-point. the portion is at least partially physically isolated from a processing portion by a thermally transmissive window.
