Apple inc. (20250113472). Electrostatic Grounding Structures
Electrostatic Grounding Structures
Organization Name
Inventor(s)
Shaowu Huang of Los Altos CA US
Jing Li Lim of Sunnyvale CA US
Keong W. Kam of San Jose CA US
Michael J. Woods of Sunnyvale CA US
Ramachandran Chundru of Cupertino CA US
Jan K. Quijalvo of San Jose CA US
Martin R. Kardasz of Mountain View CA US
Electrostatic Grounding Structures
This abstract first appeared for US patent application 20250113472 titled 'Electrostatic Grounding Structures
Original Abstract Submitted
a head-mounted device includes a connector that electrically connects a first component to a second component. a first low impedance path is provided from the connector to the first component. a second low impedance path is provided from the first component to the second component. the first low impedance path and the second low impedance path reduce the likelihood and/or severity of electrostatic discharge events and/or electrostatic coupling that may affect the head-mounted device.