Apple inc. (20240373575). ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS simplified abstract
ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS
Organization Name
Inventor(s)
Abhijeet Misra of Mountain View CA (US)
Hoishun Li of Sunnyvale CA (US)
Todd S. Mintz of San Jose CA (US)
Isabel Yang of San Jose CA (US)
James A. Curran of Sunnyvale CA (US)
ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240373575 titled 'ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS
The abstract of the patent application describes a housing for an electronic device that includes an exterior titanium portion, an interior metal joined to the exterior titanium portion, and an intermetallic compound between the interior metal and the exterior titanium portion.
- The housing for an electronic device has an exterior titanium portion.
- The interior of the housing is made of a different metal than the exterior titanium portion.
- An intermetallic compound with a thickness of less than 1 μm is placed between the interior metal and the exterior titanium portion.
Potential Applications: - This technology can be used in the manufacturing of electronic devices such as smartphones, laptops, and tablets. - It can also be applied in aerospace industries for lightweight and durable components.
Problems Solved: - Provides a strong and durable housing for electronic devices. - Ensures proper conductivity and heat dissipation within the device.
Benefits: - Enhanced durability and strength of the housing. - Improved performance and longevity of electronic devices.
Commercial Applications: - This technology can be utilized by electronic device manufacturers to improve the quality and longevity of their products, leading to increased customer satisfaction and brand loyalty.
Questions about the technology: 1. How does the use of an intermetallic compound improve the housing for electronic devices? 2. What are the potential drawbacks of using titanium in the exterior portion of the housing?
Original Abstract Submitted
a housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 �m disposed between the interior metal and the exterior titanium portion.