Apple inc. (20240373574). ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS simplified abstract
ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS
Organization Name
Inventor(s)
Abhijeet Misra of Mountain View CA (US)
Hoishun Li of Sunnyvale CA (US)
Todd S. Mintz of San Jose CA (US)
Isabel Yang of San Jose CA (US)
James A. Curran of Sunnyvale CA (US)
ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240373574 titled 'ELECTRONIC DEVICE INCLUDING CLAD COMPONENTS
The abstract describes a housing for an electronic device that includes an exterior titanium portion, an interior metal joined to the exterior titanium portion (which is a different metal), and an intermetallic compound with a thickness of less than 1 μm between the interior metal and the exterior titanium portion.
- The housing for an electronic device consists of an exterior titanium portion.
- The interior metal is different from the exterior titanium portion and is joined to it.
- An intermetallic compound with a thickness of less than 1 μm is present between the interior metal and the exterior titanium portion.
Potential Applications: - This technology could be used in the manufacturing of electronic devices such as smartphones, laptops, or tablets. - It may also find applications in aerospace for lightweight yet durable components.
Problems Solved: - The housing provides a strong and lightweight structure for electronic devices. - The intermetallic compound helps in bonding the different metals together effectively.
Benefits: - Enhanced durability and strength due to the use of titanium. - Lightweight design for improved portability of electronic devices.
Commercial Applications: - The technology could be utilized by electronics manufacturers to create more robust and lightweight devices, potentially appealing to consumers looking for high-quality products.
Questions about the technology: 1. How does the use of titanium in the housing improve the durability of electronic devices? 2. What are the specific advantages of having an intermetallic compound between the interior metal and the exterior titanium portion?
Original Abstract Submitted
a housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 �m disposed between the interior metal and the exterior titanium portion.