Apple inc. (20240372245). COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS simplified abstract

COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

Organization Name

apple inc.

Inventor(s)

Matthew D. Hill of Santa Clara CA (US)

Michael B. Wittenberg of Sunnyvale CA (US)

Shane Bustle of Cupertino CA (US)

Duy P. Le of Cupertino CA (US)

COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240372245 titled 'COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

The abstract of the patent application describes a housing for an electronic device, consisting of two components separated by a gap, with molded elements defining an interlock feature.

• The housing includes a first component and a second component separated by a gap.
• A first molded element is partially within the gap and defines an interlock feature.
• A second molded element is also within the gap and mechanically engages the interlock feature.
• The first component, second component, and second molded element form part of the housing's exterior surface.

Potential Applications: - Electronic devices such as smartphones, tablets, or laptops - Industrial equipment requiring secure housing components

Problems Solved: - Ensures secure assembly of housing components - Provides a durable and reliable housing for electronic devices

Benefits: - Enhanced structural integrity of the housing - Improved protection for the electronic device within

Commercial Applications: Title: Secure Housing Technology for Electronic Devices This technology can be utilized in the consumer electronics industry to improve the durability and reliability of electronic devices, leading to increased customer satisfaction and potentially reducing repair costs for manufacturers.

Questions about Secure Housing Technology for Electronic Devices: 1. How does this housing design improve the overall durability of electronic devices? - The housing design with interlocking features ensures a secure and robust assembly, reducing the risk of damage to the electronic device. 2. What are the potential cost savings for manufacturers by implementing this housing technology? - By reducing the need for repairs due to housing issues, manufacturers can save on warranty claims and repair costs.

Original Abstract Submitted

a housing for an electronic device is disclosed. the housing comprises a first component and a second component separated from the first component by a gap. the housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. the first component, the second component, and the second molded element form a portion of an exterior surface of the housing. a method of forming the housing is also disclosed.