Apple inc. (20240136345). Light Emitting Structure simplified abstract
Light Emitting Structure
Organization Name
Inventor(s)
John A. Higginson of Santa Clara CA (US)
Andreas Bibl of Los Altos CA (US)
Hsin-Hua Hu of Los Altos CA (US)
Light Emitting Structure - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136345 titled 'Light Emitting Structure
Simplified Explanation
The abstract describes a method and structure for receiving a micro device on a receiving substrate, where the micro device is punched through a passivation layer covering a conductive layer on the substrate.
- The micro device, such as a micro LED, is punched through a b-staged thermoset material or a thermoplastic material.
- The passivation layer is hardened after the micro device is punched through.
Potential Applications
This technology could be applied in the manufacturing of micro devices such as micro LEDs, sensors, or other miniaturized electronic components.
Problems Solved
This method solves the problem of securely attaching micro devices to a substrate without damaging the conductive layer underneath.
Benefits
The benefits of this technology include precise placement of micro devices, improved adhesion, and protection of the conductive layer.
Potential Commercial Applications
Potential commercial applications of this technology include the production of high-resolution displays, miniaturized sensors for various industries, and advanced electronic devices.
Possible Prior Art
One possible prior art could be the use of laser ablation techniques for micro device attachment, but this method offers a different approach by punching through a passivation layer.
Unanswered Questions
How does the hardening of the passivation layer affect the overall durability of the micro device attachment?
The hardening of the passivation layer could potentially increase the overall durability of the micro device attachment by providing additional protection and stability. However, the specific impact on long-term performance needs to be further studied.
Are there any limitations to the size or type of micro devices that can be attached using this method?
It is important to determine if there are any size restrictions or compatibility issues with different types of micro devices when using this method for attachment. Further research and testing may be needed to address this question.
Original Abstract Submitted
a method and structure for receiving a micro device on a receiving substrate are disclosed. a micro device such as a micro led device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. in an embodiment the micro led device is punched-through a b-staged thermoset material. in an embodiment the micro led device is punched-through a thermoplastic material.
