3D Printing patent applications on 28th Feb 2025

Patent Applications for 3D Printing on 28th Feb 2025

Number of patent applications containing '3D Printing' or its variations: 33

Qingdao Baisi Yijia Cosmetics Co., Ltd (20250064159). FALSE EYELASH MANUFACTURING PROCESS AND PROCESSING DEVICE

Organization: Qingdao Baisi Yijia Cosmetics Co., Ltd

Inventor(s): Xiaoyan ZHANG of Qingdao (CN) for Qingdao Baisi Yijia Cosmetics Co., Ltd, Zhaozhong ZHANG of Qingdao (CN) for Qingdao Baisi Yijia Cosmetics Co., Ltd

IPC Code(s): A41G5/02

CPC Code(s): A41G5/02

Drylock Technologies NV (20250064650). SEAMLESS DISPOSABLE ABSORBENT GARMENT

Organization: Drylock Technologies NV

Inventor(s): Ricardo Borrero of Eau Claire WI (US) for Drylock Technologies NV, Michael Wayne Harris of Eau Claire WI (US) for Drylock Technologies NV, Michael Sandor of Eau Claire WI (US) for Drylock Technologies NV

IPC Code(s): A61F13/496, A41B9/00

CPC Code(s): A61F13/4963

ETH Zurich (20250065307). ADDITIVE MANUFACTURING OF STRUCTURES FOR USE IN A THERMOCHEMICAL FUEL PRODUCTION PROCESS

Organization: ETH Zurich

Inventor(s): Aldo STEINFELD of Brugg (CH) for ETH Zurich, André STUDART of Zürich (CH) for ETH Zurich, Rafael NICOLOSI LIBANORI of Glattbrugg (CH) for ETH Zurich, Fabio Luca BARGARDI of Wollerau (CH) for ETH Zurich, Sebastian SAS BRUNSER of Glattpark (CH) for ETH Zurich, Noëmi KAUFMANN of Winterthur (CH) for ETH Zurich, Sabrina KISTLER of Döttingen (CH) for ETH Zurich

IPC Code(s): B01J23/10, B01J21/12, B01J31/06, B01J31/26, B01J35/56, B01J37/02, B01J37/08, B33Y40/20, B33Y70/10, B33Y80/00, C01B3/06

CPC Code(s): B01J23/10

Headmade Materials GmbH (20250065398). PARTICULATE FEEDSTOCK COMPOUND FOR USE IN A POWDER BED ADDITIVE MANUFACTURING PROCESS, AND SHAPING AND SINTERING PROCESS

Organization: Headmade Materials GmbH

Inventor(s): Christian STAUDIGEL of Unterpleichfeld (DE) for Headmade Materials GmbH, Christian FISCHER of Unterpleichfeld (DE) for Headmade Materials GmbH

IPC Code(s): B22F1/103, B22F1/05, B22F10/16, B33Y10/00, B33Y70/00, B33Y80/00

CPC Code(s): B22F1/103

Gamma Alloys, Inc. (20250065399). METHOD OF FABRICATING A METAL MATRIX COMPOSITE (MMC) FEEDSTOCK MATERIAL FOR ADDITIVE MANUFACTURING, AND METHOD OF ADDITIVELY MANUFACTURING A MMC COMPONENT

Organization: Gamma Alloys, Inc.

Inventor(s): Yuzheng Zhang of Stevenson Ranch CA (US) for Gamma Alloys, Inc., William C. Harrigan, JR. of Porter Ranch CA (US) for Gamma Alloys, Inc., Mark Sommer of Pacific Palisades CA (US) for Gamma Alloys, Inc., Micah Lee Peabody of Seminole FL (US) for Gamma Alloys, Inc.

IPC Code(s): B22F1/12, B22F10/22, B22F10/70, B22F12/53, B33Y10/00, B33Y70/10

CPC Code(s): B22F1/12

The Research Foundation for The State University of New York (20250065401). HIGH THROUGHPUT ADDITIVELY MANUFACTURED COOLING DEVICES

Organization: The Research Foundation for The State University of New York

Inventor(s): Scott N. Schiffres of Binghamton NY (US) for The Research Foundation for The State University of New York, Arad Azizi of Binghamton NY (US) for The Research Foundation for The State University of New York

IPC Code(s): B22F7/08, B22F10/14, B29C64/118, B29L31/34, B33Y10/00, B33Y80/00, H05K7/20

CPC Code(s): B22F7/08

COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN (20250065405). METHOD FOR PRODUCING A MOLDING ELEMENT WITH REMOVAL OF MATERIAL FROM A POROUS REGION AND MOLD OBTAINED THEREBY

Organization: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN

Inventor(s): ROMAIN CALVEL of Clermont-Ferrand (FR) for COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN, PATRICK ANDANSON of Clermont-Ferrand (FR) for COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN, PIERRE CHIGROS of Clermont-Ferrand (FR) for COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN, LIONEL LABEAU of Clermont-Ferrand (FR) for COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN

IPC Code(s): B22F10/28, B22F5/00, B29D30/06, B33Y10/00, B33Y80/00

CPC Code(s): B22F10/28

JEOL Ltd. (20250065407). Build Data Generating Device, Three-Dimensional Powder Bed Fusion Additive Manufacturing System, and Three-Dimensional Powder Bed Fusion Additive Manufacturing Method

Organization: JEOL Ltd.

Inventor(s): Taku Hisaki of Tokyo (JP) for JEOL Ltd., Takashi Sato of Tokyo (JP) for JEOL Ltd., Kozo Koiwa of Tokyo (JP) for JEOL Ltd.

IPC Code(s): B22F10/366, B22F10/28, B22F10/85, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B22F10/366

GOODRICH CORPORATION (20250065409). PRODUCING ULTRA-FINE-GRAINED MATERIALS USING ADDITIVE MANUFACTURING

Organization: GOODRICH CORPORATION

Inventor(s): Luke B. Borkowski of West Hartford CT (US) for GOODRICH CORPORATION, Alexander Staroselsky of Avon CT (US) for GOODRICH CORPORATION, Ranadip Acharya of Glastonbury CT (US) for GOODRICH CORPORATION, Sergey Mironets of Burlington (CA) for GOODRICH CORPORATION

IPC Code(s): B22F10/50, B22F12/13, B22F12/30, B22F12/43, B33Y10/00, B33Y30/00, B33Y40/00

CPC Code(s): B22F10/50

JEOL Ltd. (20250065410). Build Data Generating Device, Three-Dimensional Power Bed Fusion Additive Manufacturing System, and Three-Dimensional Power Bed Fusion Additive Manufacturing Method

Organization: JEOL Ltd.

Inventor(s): Taku Hisaki of Tokyo (JP) for JEOL Ltd., Takashi Sato of Tokyo (JP) for JEOL Ltd., Kozo Koiwa of Tokyo (JP) for JEOL Ltd.

IPC Code(s): B22F10/85, B22F10/28, B22F10/36, B22F12/90, B33Y30/00, B33Y50/02

CPC Code(s): B22F10/85

General Electric Company (20250065411). DETECTING OPTICAL ANOMALIES ON OPTICAL ELEMENTS USED IN AN ADDITIVE MANUFACTURING MACHINE

Organization: General Electric Company

Inventor(s): Fabian Zeulner of Lichtenfels (DE) for General Electric Company, Christian Dicken of Bamberg (DE) for General Electric Company, Justin Mamrak of Loveland OH (US) for General Electric Company, MacKenzie Ryan Redding of Mason OH (US) for General Electric Company, Bertram Gaerber of Neustadt bei Coburg (DE) for General Electric Company

IPC Code(s): B22F10/85, B22F10/28, B22F12/41, B22F12/49, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B22F10/85

Unknown Organization (20250065412). BUILD PLATE ASSEMBLY FOR ADDITIVE MANUFACTURING

Organization: Unknown Organization

Inventor(s): Daniel Roy Ryan of Fenton MI (US) for Unknown Organization, Whitney Ann POLING of Rochester Hills MI (US) for Unknown Organization

IPC Code(s): B22F12/30, B33Y30/00

CPC Code(s): B22F12/30

RTX Corporation (20250065413). POWDER BED FUSION BUILD PLATE THERMAL HISTORY INDICATOR

Organization: RTX Corporation

Inventor(s): Lawrence A. Binek of Glastonbury CT (US) for RTX Corporation, Joseph E. Ott of Enfield CT (US) for RTX Corporation, Benjamin G. Gardell of Bristol CT (US) for RTX Corporation, Dean R. Sirois of Enfield CT (US) for RTX Corporation, Alexandru Cadar of Eastford CT (US) for RTX Corporation, Jesse R. Boyer of Middletown CT (US) for RTX Corporation, Michael Walter Bennett of East Hartford AL (US) for RTX Corporation

IPC Code(s): B22F12/30, B22F10/28, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/00

CPC Code(s): B22F12/30

GE Additive Germany GmbH (20250065415). METHOD AND APPARATUS FOR FLUID FLOW FOR ADDITIVE MANUFACTURING APPARATUS

Organization: GE Additive Germany GmbH

Inventor(s): Benedikt Roidl of Munich (DE) for GE Additive Germany GmbH, Thomas Fauner of Garching (DE) for GE Additive Germany GmbH, Peter Pontiller-Schymura of Kulmbach (DE) for GE Additive Germany GmbH

IPC Code(s): B22F12/70, B22F10/85, B33Y30/00, B33Y40/00, B33Y50/02

CPC Code(s): B22F12/70

LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST) (20250065554). METHOD FOR MANUFACTURING A COMPOSITE FILAMENT AND USE THEREOF

Organization: LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)

Inventor(s): Henri PERRIN of Esch-Sur-Alzette (LU) for LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST), Loïc BORGHINI of Esch-Sur-Alzette (LU) for LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST), Sébastien KLEIN of Esch-Sur-Alzette (LU) for LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)

IPC Code(s): B29C48/154, B29B15/12, B29B15/14, B29C70/38, B29K33/04, B29K307/04

CPC Code(s): B29C48/154

Evolve Additive Solutions, Inc. (20250065559). ADDITIVE MANUFACTURING SYSTEM AND METHOD WITH SMOOTH SURFACE

Organization: Evolve Additive Solutions, Inc.

Inventor(s): Brian Mullen of Delano MN (US) for Evolve Additive Solutions, Inc.

IPC Code(s): B29C64/141, B29C64/188, B29C64/40, B33Y10/00, B33Y40/20

CPC Code(s): B29C64/141

Thermwood Corporation (20250065560). METHOD OF PRODUCING PATTERNS, MOLDS, AND RELATED PRODUCTS

Organization: Thermwood Corporation

Inventor(s): Kenneth J. SUSNJARA of Birdseye IN (US) for Thermwood Corporation

IPC Code(s): B29C64/147, B29C64/30, B29K101/10, B33Y10/00, B33Y40/20

CPC Code(s): B29C64/147

EXGINEERING SA (20250065564). DEPOSITION PLANE FOR ADDITIVE MANUFACTURING PROCESSES

Organization: EXGINEERING SA

Inventor(s): SIMONE MACCAGNAN of Castronno (VA) (IT) for EXGINEERING SA

IPC Code(s): B29C64/245, B29C64/232, B29C64/393, B33Y30/00, B33Y50/02

CPC Code(s): B29C64/245

3D Systems, Inc. (20250065565). Three-Dimensional Printing System with Build Area That is Larger than a Build Plane

Organization: 3D Systems, Inc.

Inventor(s): Akarsh Sivaprasad of Nashua NH (US) for 3D Systems, Inc.

IPC Code(s): B29C64/255, B29C64/129, B29C64/236, B29C64/277, B33Y10/00, B33Y30/00

CPC Code(s): B29C64/255

Seurat Technologies, Inc. (20250065566). Chamber Systems For Additive Manufacturing

Organization: Seurat Technologies, Inc.

Inventor(s): James A. DeMuth of Woburn MA (US) for Seurat Technologies, Inc., Erik Toomre of Los Altos CA (US) for Seurat Technologies, Inc., Francis L. Leard of Sudbury MA (US) for Seurat Technologies, Inc., Kourosh Kamshad of Hudson NH (US) for Seurat Technologies, Inc., Heiner Fees of Bietigheim-Bissingen (DE) for Seurat Technologies, Inc., Eugene Berdichevsky of Oakland CA (US) for Seurat Technologies, Inc.

IPC Code(s): B29C64/264, B22F3/24, B22F10/00, B22F10/10, B22F10/28, B22F10/32, B22F10/34, B22F10/36, B22F10/47, B22F10/50, B22F10/64, B22F10/70, B22F10/73, B22F12/00, B22F12/17, B22F12/20, B22F12/30, B22F12/33, B22F12/41, B22F12/44, B22F12/45, B22F12/53, B22F12/70, B22F12/88, B22F12/90, B23K15/00, B23K15/06, B23K26/00, B23K26/03, B23K26/08, B23K26/082, B23K26/12, B23K26/142, B23K26/144, B23K26/16, B23K26/342, B23K26/36, B23K26/70, B23K37/04, B23K101/00, B23K101/02, B23K101/24, B23K103/00, B25J11/00, B28B1/00, B29C64/153, B29C64/268, B29C64/386, B29K105/00, B33Y10/00, B33Y30/00, B33Y40/00, B33Y50/02, B33Y70/00, B33Y80/00, B33Y99/00, G02B7/14, G02B7/16, G02B7/182, G02B15/04, G02B15/10, G02B19/00, G02B26/08, G02B27/00, G02B27/09, G02B27/10, G02B27/14, G02B27/28, G02F1/01, G02F1/1333, G02F1/135, G05B17/02, G07C3/14, H01S5/00, H01S5/40

CPC Code(s): B29C64/264

RTX Corporation (20250065567). INSITU BUILD POWDER CHARACTERIZATION FOR POWDER BED FUSION

Organization: RTX Corporation

Inventor(s): Lawrence A. Binek of Glastonbury CT (US) for RTX Corporation, Joseph E. Ott of Enfield CT (US) for RTX Corporation, Dean R. Sirois of Enfield CT (US) for RTX Corporation, Jesse R. Boyer of Middletown CT (US) for RTX Corporation, Benjamin G. Gardell of Bristol CT (US) for RTX Corporation, Michael Walter Bennett of East Hartford CT (US) for RTX Corporation, Alexandru Cadar of Eastford CT (US) for RTX Corporation

IPC Code(s): B29C64/307, B29C64/153, B29C64/35, B29C64/393

CPC Code(s): B29C64/307

International Business Machines Corporation (20250065570). ACCOMMODATION OF DECOMPOSITION OF OBJECTS CREATED USING ADDITIVE MANUFACTURING

Organization: International Business Machines Corporation

Inventor(s): Randy A. RENDAHL of Raleigh NC (US) for International Business Machines Corporation, Tushar AGRAWAL of West Fargo ND (US) for International Business Machines Corporation, Jeremy R. FOX of Georgetown TX (US) for International Business Machines Corporation, Sarbajit K. RAKSHIT of Kolkata (IN) for International Business Machines Corporation

IPC Code(s): B29C64/393, B29C64/364, G06F30/20

CPC Code(s): B29C64/393

SIKA TECHNOLOGY AG (20250066251). MINERAL BINDER COMPOSITION FOR 3D PRINTING

Organization: SIKA TECHNOLOGY AG

Inventor(s): Gary BOON of Dubai (AE) for SIKA TECHNOLOGY AG, Maxime LIARD of Zürich (CH) for SIKA TECHNOLOGY AG, Didier LOOTENS of Küssnacht (CH) for SIKA TECHNOLOGY AG, Lolita HAUGUEL of Zürich (CH) for SIKA TECHNOLOGY AG

IPC Code(s): C04B28/06, B28B1/00, B33Y10/00, B33Y70/10, C04B14/28, C04B22/14, C04B24/26, C04B24/38, C04B40/00, C04B103/00, C04B103/10, C04B103/32, C04B103/50, C04B111/00

CPC Code(s): C04B28/065

COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (AN INDIAN REGISTERED BODY INCORPORATED UNDER THE (20250066544). AN AMINO ACID BASED BIODEGRADABLE, PHOTOCURABLE COMPOSITION FOR 3D PRINTING APPLICATION

Organization: COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (AN INDIAN REGISTERED BODY INCORPORATED UNDER THE

Inventor(s): Asha SYAMAKUMARI of Pune (IN) for COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (AN INDIAN REGISTERED BODY INCORPORATED UNDER THE, Ganesh Narsing KAMBLE of Pune (IN) for COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (AN INDIAN REGISTERED BODY INCORPORATED UNDER THE

IPC Code(s): C08G63/685, B33Y70/00

CPC Code(s): C08G63/6856

Poly-Med, Inc. (20250066607). POLYMERS FOR ADDITIVE MANUFACTURING

Organization: Poly-Med, Inc.

Inventor(s): Michael Scott Taylor of Anderson SC (US) for Poly-Med, Inc., James Hyde of Anderson SC (US) for Poly-Med, Inc., Brian Gaerke of Anderson SC (US) for Poly-Med, Inc., Brad Johns of Anderson SC (US) for Poly-Med, Inc., Michael Aaron Vaughn of Anderson SC (US) for Poly-Med, Inc., Seth Dylan McCullen of Anderson SC (US) for Poly-Med, Inc., David Gravett of Anderson SC (US) for Poly-Med, Inc.

IPC Code(s): C08L71/02, B29B11/10, B29B13/00, B29C64/118, B29C64/314, B29C71/00, B29K101/12, B33Y10/00, B33Y40/10, B33Y40/20, B33Y70/00, B33Y70/10, C08L67/04

CPC Code(s): C08L71/02

Raytheon Technologies Corporation (20250067198). INTEGRAL STATOR VANE WELD SHIELD

Organization: Raytheon Technologies Corporation

Inventor(s): Lawrence A. Binek of Glastonbury CT (US) for Raytheon Technologies Corporation, Jesse R. Boyer of Middletown CT (US) for Raytheon Technologies Corporation

IPC Code(s): F01D25/28, F01D9/04

CPC Code(s): F01D25/285

Electric Power Research Institute, Inc. (20250067373). Methodology to Enable the Use of Oxide Dispersion Strengthened Alloys and Precipitation Strengthen Nickel-Based Alloys for Advanced Energy Systems

Organization: Electric Power Research Institute, Inc.

Inventor(s): David Wayne Gandy of Clinton NC (US) for Electric Power Research Institute, Inc., Mark Albert of Charlotte NC (US) for Electric Power Research Institute, Inc.

IPC Code(s): F16L23/024, B22F5/10, B22F10/25, B22F10/28, B33Y10/00, B33Y70/00, B33Y80/00

CPC Code(s): F16L23/024

Ivoclar Vivadent AG (20250067600). PROCESS CONTROL METHOD FOR A 3D PRINTING PROCESS

Organization: Ivoclar Vivadent AG

Inventor(s): Joachim Reissner of Nüziders (AT) for Ivoclar Vivadent AG, Jörg Ebert of Buchs (CH) for Ivoclar Vivadent AG, Lorenz Josef Bonderer of Sargans (CH) for Ivoclar Vivadent AG

IPC Code(s): G01J5/08, B29C64/124, B29C64/245, B29C64/264, B29C64/393, B33Y10/00, B33Y30/00, B33Y50/02, G01J5/00

CPC Code(s): G01J5/0859

STRATASYS LTD. (20250068136). SYSTEM AND METHOD OF PRINTING A COLORED THREE-DIMENSIONAL OBJECT

Organization: STRATASYS LTD.

Inventor(s): Shai WAISEL of Petach Tikva (IL) for STRATASYS LTD., Yosef MELLER of Even Yehuda (IL) for STRATASYS LTD.

IPC Code(s): G05B19/042, B33Y50/00

CPC Code(s): G05B19/042

Desktop Metal, Inc. (20250068143). METHODS OF TOLERANCE ANALYSIS AND ADJUSTMENTS IN ADDITIVE MANUFACTURING

Organization: Desktop Metal, Inc.

Inventor(s): Andrew Fiske ROBERTS of Charlestown MA (US) for Desktop Metal, Inc.

IPC Code(s): G05B19/4093

CPC Code(s): G05B19/40935

Seurat Technologies, Inc. (20250068786). Additive Manufacturing Simulation System and Method

Organization: Seurat Technologies, Inc.

Inventor(s): James A. DeMuth of Woburn MA (US) for Seurat Technologies, Inc., Erik Toomre of Los Altos CA (US) for Seurat Technologies, Inc.

IPC Code(s): G06F30/17, B33Y50/00

CPC Code(s): G06F30/17

VISHAY DALE ELECTRONICS, LLC (20250069797). ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS, AND METHODS OF MANUFACTURING ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS

Organization: VISHAY DALE ELECTRONICS, LLC

Inventor(s): Benjamin Hanson of Yankton SD (US) for VISHAY DALE ELECTRONICS, LLC, Rodney Brune of Columbus NE (US) for VISHAY DALE ELECTRONICS, LLC, Matt Huber of Yankton SD (US) for VISHAY DALE ELECTRONICS, LLC

IPC Code(s): H01F27/28, H01F41/02, H01F41/04

CPC Code(s): H01F27/2852

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (20250070089). 3-DIMENSIONAL ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Organization: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor(s): Yong Suk Yang of Daejeon (KR) for ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Myung Lae Lee of Daejeon (KR) for ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Jengsu Yoo of Daejeon (KR) for ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Yoonsik Yi of Daejeon (KR) for ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

IPC Code(s): H01L25/065, H01L25/00

CPC Code(s): H01L25/0657