THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THE SAME

Abstract: a thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.

Inventor(s): Sung Han KIM, Se Yeon HWANG, Joon Woo GI, Jong Ho CHUNG, Han KIM

CPC Classification: H10N10/17 (characterised by the structure or configuration of the cell or thermocouple forming the device)

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