ELECTRONIC DEVICE

Abstract: an electronic device includes a first substrate, a first circuit layer, a semiconductor chip, and a transparent conductive layer. the first circuit layer is disposed on the first substrate. the semiconductor chip is disposed on the first substrate and electrically connected to the first circuit layer. the semiconductor chip includes a semiconductor die, a filling layer, and a reflective layer. the semiconductor die has a surface and another surface opposite to the surface. the filling layer surrounds the semiconductor die. the reflective layer is disposed on the filling layer and the semiconductor die. the reflective layer includes a first part and a second part. the first part is disposed on the surface of the semiconductor die. the second part is disposed on the filling layer. the conductive layer is disposed on the another surface of the semiconductor die and connects to the second part.

Inventor(s): Jan-Hsiang Yang, Tzu-Min Yan

CPC Classification: H10H29/857 (No explanation available)

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