ELECTRONIC DEVICE AND SEMICONDUCTOR CHIP THEREOF

Abstract: an electronic device includes a substrate, a circuit layer, and a semiconductor chip. the circuit layer is disposed on the substrate. the semiconductor chip is disposed on the substrate and electrically connected to the circuit layer. the semiconductor chip includes a semiconductor die, a filling layer, a first electrode, a second electrode, and a reflective layer. the semiconductor die includes a first type semiconductor layer, an active layer, and a second type semiconductor layer stacked in sequence. the filling layer surrounds the semiconductor die and includes a light conversion material. the first electrode is disposed on a first side of the semiconductor die and electrically connected to the first type semiconductor layer. the second electrode is disposed on a second side of the semiconductor die and electrically connected to the second type semiconductor layer.

Inventor(s): Shu-Ming Kuo, Tsau-Hua Hsieh, Jian-Jung Shih

CPC Classification: H10H20/856 (No explanation available)

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