SEMICONDUCTOR CHIP

Abstract: a semiconductor chip includes a semiconductor die, a filling layer, a first electrode, a second electrode, and a reflective layer. the semiconductor die includes a first type semiconductor layer, an active layer, and a second type semiconductor layer stacked in sequence. the filling layer surrounds the semiconductor die. the first electrode is disposed on a first side of the semiconductor die and electrically connected to the first type semiconductor layer. the second electrode is disposed on a second side of the semiconductor die and electrically connected to the second type semiconductor layer. in a top view, a first virtual line segment crossing a center of the semiconductor die intersects with an edge of the filling layer at a first point and a second point. a distance between the center and the first point is different from a distance between the center and the second point.

Inventor(s): Shu-Ming Kuo, Tsau-Hua Hsieh, Jian-Jung Shih

CPC Classification: H10H20/853 (No explanation available)

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