SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Abstract: a semiconductor device includes a circuit region including a pad region, and a cell region including a memory cell structure on the circuit region. the semiconductor device includes a stacked region where the cell region is stacked on the circuit region and a non-stacked region where the pad region of the circuit region is positioned outside the stacked region. the semiconductor device further includes a plurality of the semiconductor devices stacked atop each other and electrically connected to each other in the pad regions. a bonding layer is between adjacently stacked devices.

Inventor(s): Siwan Kim, Joonyoung Kwon, Junhyoung Kim, Jiyoung Kim, Sukkang Sung

CPC Classification: H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass)

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