20250234478. Patterned Bolster Plate (Intel)
PATTERNED BOLSTER PLATE AND COMPOSITE BACK PLATE FOR SEMICONDUCTOR CHIP LGA PACKAGE AND COOLING ASSEMBLY RETENTION
Abstract: an apparatus is described. the apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. the back plate includes a first material and a second material. the first material has greater stiffness than the second material. the back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. an improved bolster plate having inner support arms has also been described.
Inventor(s): Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan, Olaotan Elenitoba-Johnson, Mengqi Liu
CPC Classification: H05K7/1489 (Mounting supporting structure in casing or on frame or rack)
Search for rejections for patent application number 20250234478
- Patent Applications
- Intel Corporation
- CPC H05K7/1489
- Phil Geng of Washougal WA US
- Ralph V. Miele of Hillsboro OR US
- David Shia of Portland OR US
- Jeffory L. Smalley of East Olympia WA US
- Eric W. Buddrius of Hillsboro OR US
- Sean T. Sivapalan of Portland OR US
- Olaotan Elenitoba-Johnson of Tigard OR US
- Mengqi Liu of Hillsboro OR US