CHIP-TO-CHIP INTERCONNECT DESIGN

Abstract: electronic modules and methods for manufacturing electronic modules are described herein. some embodiments of the present invention may be directed to an electronic module that includes a main printed circuit board (pcb) having a first surface, a first chip substrate disposed on the first surface, and a second chip substrate disposed on the first surface. the electronic module may include an intermediate pcb supported by the main pcb, where at least a portion of the intermediate pcb is disposed between the first chip substrate and the second chip substrate. the intermediate pcb may electrically connect the first chip substrate to the second chip substrate. for example, the intermediate pcb may include pins extending substantially parallel to the first surface, and the first chip substrate and the second chip substrate may include contacts configured to electrically connect to the pins of the intermediate pcb.

Inventor(s): Zikuan QIU, Yu Cheng CHANG, Rong FANG, Ruixuan LI, Jianhua DING, Jie ZHOU

CPC Classification: H05K1/145 (Structural association of two or more printed circuits (providing electric connection to or between printed circuits , ))

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