METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME

Abstract: provided are a method for producing a metal-clad laminate, including: laminating a prepreg and a metal foil by heating and pressurizing, in which the prepreg contains a thermosetting resin composition and a fiber base material having a thickness of 40 �m or more, the prepreg has a first resin layer which is provided on one surface of the fiber base material and contains the thermosetting resin composition; and a second resin layer which is provided on the other surface of the fiber base material and contains the thermosetting resin composition, in which when a thickness of the first resin layer is di and a thickness of the second resin layer is d, a ratio r of a thickness difference represented by formula (1) is −9.0% to +9.0%, and surface waviness (wa) of each of both surfaces of the prepreg is 6 �m or less, and a printed wiring board and a semiconductor package using the metal-clad laminate.

Inventor(s): Takayo KITAJIMA, Shunsuke TONOUCHI, Seiya MAGOTA, Kota NAKANISHI

CPC Classification: H05K1/038 (Use of materials for the substrate)

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