SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Abstract: a stacking structure including a first die and a second die stacked the first die is provided. the first die includes a first substrate and a first bonding structure located over the first substrate. the second die includes a second substrate and a second bonding structure located over the second substrate. the first and second dies are bonded through the bonded first and second bonding structures. the bonded first and second bonding structures include fused bonding pads having homogeneous core pads and locking patterns surrounding the homogeneous core pads.

Inventor(s): HsiaoYun Lo, Tzu-Chiun Lin, Ken-Yu Chang

CPC Classification: H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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