WIRE BONDING MACHINE HAVING A ROTATABLE CAPILLARY TO SECURE A BOND WIRE TO A CONNECTION POINT

Abstract: a wire bonder has a rotatable capillary for forming a stitch bond on a bonding surface of a connection point. when the stitch bond is formed, a bond head of the wire bonder causes the capillary to rotate in a xy plane. rotation of the capillary causes at least a portion of the stitch bond to contact one or more side walls of the connection point. as a result, an entire surface area of the stitch bond contacts one or more surfaces of the connection point.

Inventor(s): Jingyun Chen, Fen Yu, Guangqiang Li, Pengchen Ai, Fuqiang Xiao, Shujun Zheng, Yuan Ming, Sizhe Yue, Lian Chen

CPC Classification: H01L24/78 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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