SEMICONDUCTOR DEVICE

Abstract: a semiconductor device includes a substrate, a lid, a semiconductor package and a thermal conductive bonding layer. the lid is attached to the substrate, wherein the lid has a first cavity and a second cavity extending from the first cavity to inside of the lid. the semiconductor package is disposed in the first cavity, below the second cavity and electrically connected to the substrate. the semiconductor package includes at least one semiconductor die, and the second cavity is disposed adjacent to periphery of the at least one semiconductor die in a top view of the semiconductor device. the thermal conductive bonding layer attaches the lid to the semiconductor package and extends into at least a portion of the second cavity.

Inventor(s): Yi-Huan Liao, Chih-Hao Chen, Ping-Yin Hsieh, Yi Wen Huang, Pu Wang, Li-Hui Cheng

CPC Classification: H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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