SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

Abstract: a disclosed method can include (i) forming a cavity in a substrate core for a semiconductor device from a floor of the substrate core to a ceiling of the substrate core, (ii) bonding an electronic component to an element through a bonding layer to form an electronic component aggregation, (iii) disposing the electronic component aggregation within the cavity, and (iv) filling the cavity. various other apparatuses, systems, and methods are also disclosed.

Inventor(s): Arsalan Alam, Rahul Agarwal, Chandra Sekhar Mandalapu, Sri Ranga Sai Boyapati

CPC Classification: H01L23/642 ({Capacitive arrangements (, , , take precedence; capacitive effects between wiring layers on the semiconductor body )})

Search for rejections for patent application number 20250233087