SEMICONDUCTOR DEVICE

Abstract: an object of the present disclosure is to provide a semiconductor device capable of improving reliability. a semiconductor device according to the present disclosure includes an insulating sheet on which one die pad is disposed, an insulating sheet on which a plurality of die pads are disposed, a semiconductor switch and a rectification diode disposed on the die pad, a semiconductor switch and a rectification diode disposed on each die pad, and a heatsink bonded to the insulating sheet and the insulating sheet.

Inventor(s): Hongbo ZHANG

CPC Classification: H01L23/49558 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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