COOLING DEVICE

Abstract: a cooling device for cooling a component includes a base element with a first surface and a second surface opposite the first surface and forming a rear side, and with a cooling structure having cooling elements that is arranged on the base element so as to protrude over the first surface. the rear side of the base element has a curved configuration and a prestress. alternatively or additionally, at least one auxiliary element is arranged on the rear side to create a substance bonding between the cooling device and the component.

Inventor(s): Jürgen BAUER, Manuel POHN

CPC Classification: H01L23/3677 (Cooling facilitated by shape of device {(, , , , take precedence)})

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