20250233039. Method Fabricating Package Struct (Taiwan Semiconductor Manufacturing , .)

METHOD OF FABRICATING PACKAGE STRUCTURE

Abstract: a package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. the semiconductor package is disposed on and electrically connected to the circuit substrate. the thermal interface material is disposed on the semiconductor package. the lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. the heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.

Inventor(s): Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng

CPC Classification: H01L23/3675 (Cooling facilitated by shape of device {(, , , , take precedence)})

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