DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

Abstract: provided is a double-sided cooling semiconductor device. the device includes: a board; a semiconductor chip disposed on the board; an external connection frame disposed on the semiconductor chip; a spacer disposed on the external connection frame; and a molding part filling a space between the board and the spacer, wherein a lower surface of the board is exposed to the outside through a lower surface of the molding part, and an upper surface of the spacer is exposed to the outside through an upper surface of the molding part.

Inventor(s): Ki-Myung YOON, In-Suk KIM, Jooyaung EOM

CPC Classification: H01L23/24 (solid or gel at the normal operating temperature of the device {( takes precedence)})

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