MANAGING SEMICONDUCTOR WAFER AND DIE HANDLING

Abstract: an apparatus for securing a semiconductor wafer portion (swp) comprises: a first rotatable structure (rs) configured to perform a first rotation and a first counterrotation about a first axis; a second rs configured to perform a second rotation and a second counterrotation about a second axis; a first set of one or more adjustable adhesive regions (aars) located on the first rs and in contact with the swp, where each aar in the first set of aars is configured to increase its adhesion to the swp during the first rotation and to decrease its adhesion during the first counterrotation; and a second set of one or more aars located on the second rs and in contact with the swp, where each aar in the second set of aars is configured to increase its adhesion to the swp during the second rotation and decrease its adhesion during the second counterrotation.

Inventor(s): Martin Caron, Raphael Beaupré-Laflamme, Simon Savard

CPC Classification: H01L21/687 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks )})

Search for rejections for patent application number 20250233005