Transfer System and Semiconductor Manufacturing Method

Abstract: a transfer system used in a semiconductor manufacturing device in which a moving body having a magnet moves while being levitated from a floor by a magnetic force to transfer a substrate to a processing module for processing the substrate is provided. the transfer system comprises: a through-hole forming member having a through-hole formed in a vertical direction; a blocking member that blocks the through-hole to form the floor; a housing of which bottom wall serving as the floor and of which inside is evacuated to create a vacuum atmosphere in a moving area of the moving body that is formed on the floor; a plurality of electromagnets provided inside the floor to move the moving body; and magnetic sensors disposed inside the floor at positions overlapping the through-hole forming member and the blocking member in plan view, and configured to detect a magnetic force of the magnet.

Inventor(s): Hikaru OZONE

CPC Classification: H01L21/67709 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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