WAFER HOLDER DEVICE HAVING HEATING FUNCTION

Abstract: a wafer holder device having a heating function includes a fixing ring, a holder plate, and a heating plate. the fixing ring surrounds a hollow area, and the fixing ring includes a top and a bottom. the hollow area connects the top and the bottom. the holder plate includes a holding surface and a bottom surface. the holder plate is removably fixed to the top of the fixing ring, and the bottom surface of the holder plate covers the hollow area. a coefficient of thermal expansion of the holder plate is smaller than a coefficient of thermal expansion of the fixing ring. the heating plate is provided within the hollow area for heating the bottom surface of the holder

Inventor(s): Jung-Hua Chang, Ta-Hao Kuo

CPC Classification: H01L21/67103 ({mainly by conduction})

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