SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract: a substrate processing apparatus includes a processing chamber including a processing space, a substrate support that receives a substrate and support the substrate in the processing chamber, a fluid supply pipe arranged at a lower portion of the processing chamber, and a fluid supply device that supplies a processing fluid to the processing space through the fluid supply pipe. the processing chamber includes a step portion and a round portion both in an upper surface that defines the processing space, and a first horizontal separation distance from a center of the processing chamber to the step portion is greater than a second horizontal separation distance from the center of the processing chamber to an edge of the substrate.

Inventor(s): Junho Lee, Sungjun Noh, Jihoon Jeong, Songyun Kang, Taeheon Kim, Younghoo Kim, Junho Yoon, Jongwon Lee, Jiwoong Jung, Jeonghwa Hong

CPC Classification: H01L21/67034 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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