20250232980. Method Manufacturing Semiconductor Struct (Taiwan Semiconductor Manufacturing , .)

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

Abstract: a method for manufacturing a semiconductor structure is provided. the method includes forming a transistor over the first wafer; bonding a first wafer to a second wafer; trimming an edge region of the first wafer along a circular trimming path, wherein a center of the circular trimming path is offset from a center of the second wafer in a top view; after trimming the edge region of the first wafer, thinning down the first wafer; and after thinning down the first wafer, forming a backside conductive feature electrically connected to the transistor.

Inventor(s): Wen-Yen CHEN, Tsai-Yu HUANG, Chi On CHUI

CPC Classification: H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {( takes precedence)})

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