IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPLITTING PROCESS

Abstract: methods of forming a crystalline wafers such as silicon carbide wafers are disclosed. such a method may include providing a crystalline substrate comprising a substrate first surface and a substrate second surface opposite the substrate first surface. the method may also include creating a separation layer at a first depth from the substrate first surface and creating a mitigation layer at a second depth from a substrate second surface. creating the separation layer may cause the crystalline substrate to bow, and creating the mitigation layer may reduce the bow of the crystalline substrate. the method may further include separating the wafer from the crystalline substrate along the separation layer.

Inventor(s): Jeremy Andre Turcaud, Dong Lee, Dennis Rossman, Greg Lucchesi, Ben Chan

CPC Classification: H01L21/265 (producing ion implantation)

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