PATTERN MEASUREMENT METHOD AND PATTERN MEASUREMENT APPARATUS

Abstract: a pattern measurement method includes forming a first pattern having a first size and a first brightness in a the first die area, forming a second pattern having a second size equal to the first size and a second brightness different from the first brightness in the first die area, obtaining a (1-1)-th measured size and a (1-1)-th measured brightness using a first measurement apparatus, and obtaining a (1-2)-th measured size and a (1-2)-th measured brightness using the first measurement apparatus, obtaining a (2-1)-th measured size and a (2-1)-th measured brightness using a second measurement apparatus, and obtaining a (2-2)-th measured size and a (2-2)-th measured brightness using the second measurement apparatus, and calibrating the first measurement apparatus and the second measurement apparatus based on first size correction data and first brightness correction data determined using the measured sizes and brightnesses.

Inventor(s): Ji Yong KIM, Ki Seok KWAK, Seoung-Bum JUNG

CPC Classification: G03F7/70666 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices ; photosensitive materials or processes for photographic purposes ; electrophotography, sensitive layers or processes therefor ))

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