Data Communication Device

Abstract: a communication device, consisting of at least one semiconducting die and an electronic integrated circuit (eic) formed on a first side of the at least one die. the device also has at least one first array of micro-light emitting diodes (micro-leds), mounted on a second side of the at least one die that is opposite the first side. the micro-leds are electrically connected to the eic and are configured to transmit outbound optical signals to respective first optical fibers. the device also has at least one second array of photo-diodes, mounted on the second side of the at least one die. the photo-diodes are electrically connected to the eic and are configured to receive inbound optical signals from respective second optical fibers.

Inventor(s): Pushkraj Tumne, Roberto Coccioli, Dwayne R. Shirley, Hsiu-Che Wang

CPC Classification: G02B6/425 (Coupling light guides with opto-electronic elements)

Search for rejections for patent application number 20250231357