WAFER INSPECTION METHOD

Abstract: provided is a wafer inspection method including obtaining raw data in an optical inspection process for a wafer, identifying data in the raw data corresponding to a plurality of evaluation areas, generating statistical information for first characteristics of each evaluation area of the plurality of evaluation areas from the raw data corresponding to the plurality of evaluation areas, selecting at least some of the evaluation areas as a selection area through a comparison of the statistical information of each of the evaluation histograms, selecting an inspection area including at least a portion of the selection area, and performing an electron beam (e-beam) inspection on the inspection area.

Inventor(s): Doyoung Yoon, Minsu Kim, Sunghoon Park, Jongcheon Sun, Kwangil Shin, Yusin Yang, Suyoung Lee

CPC Classification: G01N21/9501 ({Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step )})

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