CURABLE ADHESIVE COMPOSITIONS FOR BONDING ONE OR MORE SUBSTRATES

Abstract: a composition that cures when exposed to actinic radiation. in some embodiments the curable adhesive composition comprises: a) one or more radiation curable oligomers or prepolymers terminally having at least one carbon-carbon double bond-containing group; b) one or more diluent monomer components containing at least one polymerizable group; c) optionally one or more adhesion promoting additives of an organic or inorganic acid acrylic monomer; and optionally one or more rheological modifiers; one or more plasticizers and; one or more additives. the curable composition can be used in an adhesive that structurally bonds many substrates including dissimilar substrates. in some embodiments cured reaction products of the composition have a broad service temperature range from −20 to 120� c. cured reaction products of this embodiment will exhibit greater than 50% cohesive failure in this temperature range. the cured composition will retain adhesive strength at temperatures above its tg.

Inventor(s): Matthew Jay Quast, Nicole Ann Murley, Alfred A Decato, Nicholas Thomas Kamar, Renuka Subhash Patil, Martin Hornung

CPC Classification: C09J4/00 (Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups - })

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