20250230328. Polyamic Acid (PI Advanced Materials ., .)
POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME
Abstract: the present invention relates to a polyamic acid composition and a method for preparing same. polyimide using a polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance and mechanical strength, and a polyimide coating prepared using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.
Inventor(s): Gyeong Hyeon RO, Gyeong Min MOON, Ik Sang LEE
CPC Classification: C09D7/62 (COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics ; processes for applying liquids or other fluent materials to surfaces, in general, ; staining wood ; glazes or vitreous enamels ; natural resins, French polish, drying-oils, driers, turpentine, per se, ; polishing compositions other than French polish, ski waxes ; adhesives or use of materials as adhesives ; materials for sealing or packing joints or covers ; materials for stopping leaks ; processes for the electrolytic or electrophoretic production of coatings ))
Search for rejections for patent application number 20250230328