LASER ADJUSTMENT METHOD AND LASER MACHINING DEVICE

Abstract: provided is a laser adjustment method including: a first preparation process of acquiring an image including an image of a first damage formed in a first film due to irradiation of a first film wafer including a first wafer and the first film provided in the first wafer with first laser light as a first damage image; a second preparation process of preparing a second film wafer including a second wafer and a second film provided in the second wafer; a processing process of irradiating the second film wafer with second laser light after the first preparation process and the second preparation process to form a second damage in the second film; an imaging process of imaging the second film to acquire an image including an image of the second damage as a second damage image after the processing process; and an adjustment process of adjusting an aberration.

Inventor(s): Ryota SUGIO, Yusuke SEKIMOTO, Minoru YAMAMOTO, Naoto INOUE, Taichi OKUBO, Hiroaki TAMEMOTO

CPC Classification: B23K26/36 (Removing material (, take precedence))

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