SEAL STRUCTURES

Abstract: integrated circuit (ic) chips and seal ring structures are provided. an ic chip according to the present disclosure includes a device region, an inner ring surrounding the device region, an outer ring surrounding the inner ring, a first corner area between an outer corner of the inner ring and an inner corner of the outer ring, and a second corner area disposed at an outer corner of the outer ring. the first corner area includes a first active region including a channel region and a source/drain region, a first gate structure over the channel region of the first active region, and a first source/drain contact over the source/drain region of the first active region. the first source/drain contact continuously extends from a first edge of the first corner area to a second edge of the first corner area.

Inventor(s): Chun Yu Chen, Yen Lian Lai

CPC Classification: H10D84/83 (No explanation available)

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