SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

Abstract: a semiconductor power device, includes: a substrate; a first, a second, a third, and a fourth conductive regions disposed on the substrate, where the first conductive region and the second conductive region are disposed on two opposite sides of the third conductive region, the fourth conductive region is disposed between the first conductive region and the third conductive region and between the second conductive region and the third conductive region, the first, the second, and the fourth conductive regions are configured to transmit dc signals, and the third conductive region is configured to transmit ac signals; a first power chip mounted in the first conductive region and connected to the third conductive region; a second power chip mounted in the second conductive region and connected to the third conductive region; and a third power chip mounted in the third conductive region and connected to the fourth conductive region.

Inventor(s): Rui HU, Chuanming LUO, Shengsong YANG, Fuli GUO

CPC Classification: H10D80/251 (No explanation available)

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