VAPOR COMPRESSION ASSISTED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS

Abstract: disclosed herein are devices, methods, and systems for cooling an electronic component. the cooling device includes a liquid cooling loop with a heat exchanger, wherein the liquid cooling loop thermally conductively connects to the electronic component. the cooling device also includes a vapor compression cooling loop with a compressor and an expansion nozzle. the cooling device also includes an intermediate heat exchanger between the liquid cooling loop and the vapor compression cooling loop for exchanging heat between the liquid cooling loop and the vapor compression cooling loop. the cooling device also includes a controller configured to selectively activate the vapor compression cooling loop based on a power consumption of the electronic component.

Inventor(s): Sankarananda BASAK, Akhilesh RALLABANDI

CPC Classification: H05K7/20354 (Modifications to facilitate cooling, ventilating, or heating)

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