METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED SHIELD

Abstract: this invention introduces an advanced method for manufacturing printed circuit boards (pcbs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. the process involves forming trenches on the pcb, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. this refined technique offers superior reliability and paves the way for more intricate and robust electronic designs.

Inventor(s): KUO-HAO PAO, YU-CHENG LIN

CPC Classification: H05K3/3494 (by soldering)

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