COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMATCH WITH CORE

Abstract: embodiments disclosed herein include passive electrical components with thickness modifications in order to improve embedding processes. in an embodiment, such an apparatus comprises a substrate with a first width, where the substrate comprises a first surface, a second surface opposite from the first surface, and sidewall surfaces coupling the first surface to the second surface. in an embodiment, a layer with a second width that is greater than the first width contacts the substrate and covers the sidewall surfaces and the first surface of the substrate.

Inventor(s): Pratyasha MOHAPATRA, Soham AGARWAL, Pratyush MISHRA, Benjamin DUONG, Kari HERNANDEZ

CPC Classification: H05K1/186 (Printed circuits structurally associated with non-printed electric components ({, , , and} take precedence))

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