WIRING BOARD

Abstract: the wiring board includes an insulation layer made of ceramic and a conductor layer extending in a planar direction inside the insulation layer. the conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component, and has a layered structure in which a dense layer, a non-dense layer, and a dense layer are layered in layers in this order in a thickness direction.

Inventor(s): Hiroaki SANO, Toshifumi HIGASHI, Akira IMOTO, Takafumi YAMAGUCHI, Sentarou YAMAMOTO

CPC Classification: H05K1/092 ({Dispersed materials, e.g. conductive pastes or inks})

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