METHOD FOR MANUFACTURING CIRCUIT BOARD

Abstract: a method for manufacturing a circuit board that achieves both high adhesion and excellent high-frequency characteristics is provided. the circuit board includes a high-frequency circuit including a substrate, a ground layer, and a signal layer, and at least the signal layer is a layer derived from a copper foil. the method includes: (a) designing a specification of a high-frequency circuit having a predetermined impedance zbased on an assumption that the high-frequency circuit is manufactured using a copper foil without an adhesive layer; and (b) forming a high-frequency circuit in accordance with the specification, except for using, instead of the copper foil without an adhesive layer, an adhesive-layer-attached copper foil to form the signal layer so that an adhesive layer is interposed between the substrate and the signal layer, thereby manufacturing a circuit board in which the high-frequency circuit has an impedance zthat is greater than z.

Inventor(s): Hiroshi ONO, Kazuhiro OSAWA, Kei TAKAHASHI

CPC Classification: H05K1/025 ({Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance ( and take precedence; for semiconductor devices )})

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